Electrostatic Actuating Double-Unit Electrocaloric Cooling Device with High Efficiency

Bo, YW (Bo, Yiwen)^{[ 1 ]} ; Zhang, Q (Zhang, Quan)^{[ 1 ]} ; Cui, H (Cui, Heng)^{[ 1 ]} ; Wang, MY (Wang, Mengyan)^{[ 1 ]} ; Zhang, CY (Zhang, Chunyang)^{[ 1 ]} ; He, W (He, Wen)^{[ 1 ]} ; Fan, XQ (Fan, Xiangqian)^{[ 1 ]} ; Lv, YW (Lv, Yiwen)^{[ 1 ]} ; Fu, X (Fu, Xiang)^{[ 1 ]} ; Liang, JJ (Liang, Jiajie)^{[ 1 ]} ; Huang, Y (Huang, Yi)^{[ 1 ]} ; Ma, RJ (Ma, Rujun)^{[ 1 ]} ; Chen, YS (Chen, Yongsheng)^{[ 2,3,4 ]} ...更少内容

ADVANCED ENERGY MATERIALS, 2021, 文献号: 2003771

DOI: 10.1002/aenm.202003771

摘要

Compact solid-state refrigeration systems that offer a high specific cooling power and a high coefficient of performance (COP) are desirable in a wide range of applications where efficient and localized heat transfer is required. Here, a double-unit electrocaloric (EC) polymer-based refrigeration device with high intrinsic thermodynamic efficiency is demonstrated using a flexible EC polymer film with improved performance by doping plasticizer and an electrostatic actuation mechanism. The double-unit refrigeration device achieves a large temperature span of 4.8 K, which is 71% higher than that of the single-unit device. A specific cooling power of 3.6 W g(-1) and a maximum COP of 8.3 for the cooling device are produced. The surface temperature of a central processing unit (CPU) cooled by an active EC device is 22.4 K lower than that of the CPU cooled in air. The highly efficient and compact EC cooling device demonstrated here not only leapfrogs the performance of existing solid-state cooling technologies, but also brings solid state cooling closer to reality for a variety of practical applications that require compact or mechanically flexible refrigeration.