Buckled Structures: Fabrication and Applications in Wearable Electronics

Hu, XY (Hu, Xiaoyu)^{[ 1,2 ]} ; Dou, YY (Dou, Yuanyuan)^{[ 1 ]} ; Li, JJ (Li, Jingjing)^{[ 1 ]} ; Liu, ZF (Liu, Zunfeng)^{[ 1 ]}

SMALL, 2019, 15(32): 特刊: SI, 文献号: 1804805

DOI: 10.1002/smll.201804805

会议名称

会议: 1st International Conference of Novel Function Materials (ICNFM)

会议地点: Anshan, PEOPLES R CHINA

会议日期: SEP 16-18, 2018

摘要

Wearable electronics have attracted a tremendous amount of attention due to their many potential applications, such as personalized health monitoring, motion detection, and smart clothing, where electronic devices must conformably form contacts with curvilinear surfaces and undergo large deformations. Structural design and material selection have been the key factors for the development of wearable electronics in the recent decades. As one of the most widely used geometries, buckling structures endow high stretchability, high mechanical durability, and comfortable contact for human-machine interaction via wearable devices. In addition, buckling structures that are derived from natural biosurfaces have high potential for use in cost-effective and high-grade wearable electronics. This review provides fundamental insights into buckling fabrication and discusses recent advancements for practical applications of buckled electronics, such as interconnects, sensors, transistors, energy storage, and conversion devices. In addition to the incorporation of desired functions, the simple and consecutive manipulation and advanced structural design of the buckled structures are discussed, which are important for advancing the field of wearable electronics. The remaining challenges and future perspectives for buckled electronics are briefly discussed in the final section.